Characterization of Integrated Circuit Packaging Materials
by Moore (Thomas M); McKenna (Robert)
Published by : Momentum Press ISBN:9781606501870.
Subject(s):
Integrated Circuits
Year: 20
| Item type | Current location | Collection | Call number | Status | Notes | Date due | Barcode |
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Reference
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Kumaraguru College of Technology | Reference | 621.3.049.77 MOO (Browse shelf) | Available | ECE | 72204 |
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| 621.1-752 SCH VEHICLE DYNAMICS | 621.3.011.7 CRC COMPLEX NETWORKS | 621.3.049.77 GRO Integrated Circuit Test Engineering: Modern Techniques | 621.3.049.77 MOO Characterization of Integrated Circuit Packaging Materials | 621.3.049.77:681.32 "Cmos Electronics ;How It Works, How It Fails" | 621.3.049.77:681.32 CAV CMOS RFIC Design Principles | 621.3.049.77:681.32 YEO Design of CMOS RF Integrated Circuits and Systems |
Hard Binding
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