Characterization of Integrated Circuit Packaging Materials
Language: 20+274 Language: ENGLISH Publication details: Momentum Press 20+274Edition: ISBN:- 9781606501870
- 621.3.049.77 MOO
| Cover image | Item type | Current library | Home library | Collection | Shelving location | Call number | Materials specified | Vol info | URL | Copy number | Status | Notes | Date due | Barcode | Item holds | Item hold queue priority | Course reserves | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Reference
|
Kumaraguru College of Technology | Reference | 621.3.049.77 MOO (Browse shelf(Opens below)) | Available | ECE | 72204 |
Hard Binding
There are no comments on this title.
Log in to your account to post a comment.